QIII+ Surface particle detector (SPD) is a real-time, non-subjective and repeatable method for defining “clean” allowing to establish particulate baseline by count and size, and make a quantitative conclusion whether tool’s critical surfaces are in-spec/process ready or not.

Also particles might be easily and rapidly collected from specific area by means of special module and then analyzed leading to contamination sources identification. Module design eliminates sample-handling contamination.

Portable TXRF spectrometer collects localized elemental data on the surface in concern leading to better product functionality understanding and further improvements.

Practically every tool utilized in IC manufacturing has to be maintained properly to ensure high yield and overall equipment effectiveness (OEE). Therefore, tool cleaning and parts replacement is necessary from time to time. Usually tool surface is getting wiped by proper solution as the final part of the preventive maintenance procedure (PM). Then, making an assumption that the tool is clean enough, technical personal proceed further with tool pumping, and finally qualification wafers are processed to verify tool readiness. However, additional cleaning is often required when particulates amount detected on the test wafers is found higher than upper limit. It means that an assumption that the tool is clean was wrong because it was blind assumption, not supported by real numbers characterizing tool cleanliness. Tool re-clean takes hour’s increasing good wafer -to- good wafer time sufficiently.