Current Semiconductor Equipment Manufacturing is facing very challenging goal to provide reliable functional equipment for variety of different very aggressive fabrication processes. Internal parts of this equipment are in direct contact with very aggressive reactive media at extreme process parameters (plasma, high temperature). Parts erosion and particulate formation are a common problem affecting the product yield and maintenance time.

Various coating solutions are utilized to isolate equipment parts from aggressive media impact. These solutions employ anodizing, spraying, plating, sputtering, and other high vacuum and atmospheric deposition techniques forming metals, ceramics or polymers protective films, coatings or layers on wide variety of substrates. However, with still active Moore’s law, urgent necessity exists in new approaches, advanced protective coatings allowing for the regulation of phenomena and structures at atomic, molecular, nanometer and micrometer scale levels, reducing particles formation and extending parts life time. SDN technology can synthesize dense, high purity and homogeneity, thin ceramic or glass coatings with high erosion protection properties on various complex shape substrates.

Also, in stringent adherence to "best practices" in product and process development we employ Six Sigma methodology, a disciplined, data-driven approach.